Aller au contenu
|
Chinese simplified 
| Contact us 

Applications  [ Return towards  Electronic Components and Products  ]

You will benefit from the many years of industrial and laboratory experience of our teams, including their know-how on soldering process using nitrogen, the application of atmosphere.

N2 Inerting for Reflow Soldering

N2 Inerting for Wave Soldering

Liquid Nitrogen for HALT/HASS

N2 for Dry Box

Plasma Gas Source

N2 Inerting for Reflow Soldering

The miniaturization and greener products require customer to improve soldering process and SMT process, with AlixTM Reflow offer, you can evaluate the possibility of how N2 positive affect your process, how the soldering quality is improved and what should be the best atmosphere.

 The AlixTM Reflow offer you:

Fundamental technical data of soldering under N2 vs air
Easily control furnace atmosphere by auditing periodically
Create your own data center

 

 

 

N2 Inerting for Wave Soldering

Wave soldering process can also benefit from N2AlixTM  In2ertwave is specially designed for wave soldering process to be working under N2 atmosphere.

AlixTM In2ertwave offer you:

best result of dross saving to average 80% in the market
save flux up to 50%
improve soldering, improve quality
low N2 consumption to about 14Nm3/hr
low maintenance
Contact us to make an economical analysis

 

 

Liquid Nitrogen for HALT/HASS

HALT/HASS test is used to certify the reliability of a new designed product or mature product, as well as to finish the test in short time instead of normal life of product. We design AlixTM Cryo to improve test effeciency with Liquid N2 as cooling source.

With AlixTM Cryo solution, you can:

get better reliability than mechanical way
safely using liquid Nitrogen
optimize liquid Nitrogen consumption
improve throughput and lower cost

 

 

 

N2 for Dry Box

We offer AlixTM Dry box to meet your demand on on-line storage for Moisture Sensitive Device, and also for PCB. Safe and low N2 consumption.

comply with IPC/JEDEC J-STD-033 standard
fast dry down allow 1% RH less than 5 minutes
includes safety device(overpressure and asphyxiation)
low N2 consumption(patented gas injection system)
make it possible to eliminate baking
ESD-certified

 

 

 

Plasma Gas Source

Plasma cleaning is widely used in IC package process.

We supply following gases:

Ar/H2
N2/H2 
Ar/O2 in various mix ranges
O2
Other gases upon request

Please contact us!

 

                                                                Click here

Consult the Gas Encyclopedia

Properties of 138 Gases

See detail